On-Chip and Chip-to-Chip Optical Interconnects: Emerging Market Opportunities
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This report identifies the opportunities for bringing optics to the world of semiconductor chips. It considers how the semiconductor industry will combine electronic processing with on-chip optical interconnects. Although these technology developments have been discussed for a couple of decades, it is only in the past few years that it has seemed likely that this kind of technology would be needed. This change has been brought about by the growing need for processors and memories to cope with huge amounts of data as the result of the Internet-of-Things (IoT), cloud computing, “big data” video and so on. The report begins with a discussion of the strategies for dealing with the limits of electrical interconnect at the chip level and provides a roadmap of how quickly and in what way optical interconnects and optical processors will be needed. This analysis will be carried out in the context of the latest prognosis for Moore’s Law and Terabit Ethernet. Meanwhile, the roadmap and the accompanying ten-year forecast will look at the revenue potential for interconnects that are emerging from the rise of multicore processing and 3D chips as well as important materials choices in this space: alternative materials strategies for interconnect metallization, silicon photonics, the use of InP, etc. The report quantifies the opportunities of for on-chip and chip-to-chip interconnects in a ten-year forecast and provides profiles of the technology and product leaders in this space including both optical chip makers and firms who are implementing this kind of technology on circuit boards and ICs.