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In 1990s fantasies of the all-optical network, electronics played a minimal role. Today it seems that the higher bandwidth demands go the more high-performance silicon is actually needed. In CIR’s new report “400G, OTN AND NEXT-GENERATION TRANSPORT: A MARKET AND TECHNOLOGY FORECAST” (See: http://www.cir-inc.com/reports/400-g-otn-and-next-generation-transport-a-market-and-technology-forecast), we discuss (among other topics) how the first trials of 400G

Carriers worldwide are beginning to outgrow 100G transport networks and are taking the first tentative steps towards 400G backbones. CIR believes these ultra-fast networks will create major new revenue opportunities for optical components firms, silicon chipmakers and equipment companies alike. This new business will occur as 400G transport moves out of today’s trial phase and

This research note is based on CIR’s new report, “Revenue Opportunities for Optical Interconnects: Market and Technology Forecast – 2013 to 2020 Vol II: On-Chip and Chip-to-Chip” Over the next five years chip companies will experience an “interconnect bottleneck” that will cause them to create alternatives to current metal/electrical interconnects. The most likely technology direction

When CIR published a report on the optical interconnect market in 2010, the goal of the report at the time was to provide a full analysis of the entire optical interconnect business. In this year’s CIR analysis we are covering the market in two reports, focusing primarily on interconnects in the chip-to-chip and on-chip sector

This research note is based on CIR’s new report, “Revenue Opportunities for Optical Interconnects: Market and Technology Forecast – 2013-2020. Vol. I Board-to-Board and Rack-Based” CIR’s latest forecast for sales of optical interconnection devices used at the rack level and for board-to-board interconnection remains bullish. We are anticipating revenues doubling from $1.1 million to $2.2

CIR last published a report on the optical interconnect market in 2010. The goal of the report at the time was to provide a full analysis of the optical interconnect business, which was taken to include: • Optical cable assemblies inside equipment as well as between equipment, or defined as board-to-board and rack-to-rack, respectively; •

Active optical cabling (AOC) is a black-box solution to creating a fiber-optic connection and consists of a complete fiber-optic data link (transceivers plus cable) that can be plugged into existing ports, enabling a very rapid introduction of optical connections. AOCs provide customers with access to all the undisputed advantages of fiber (high bandwidth, relatively thin,